ICPST Tutorial Session

Basics of Lithography Materials Science and Technology

ICPST and TAPJ are plannnig to provide opertunity to learn advanced materials processes for semiconductor manufacturing. The detail will be annouced later. The leading edge speakers are being invited.

Joint Event of The Society of Photopolymer Sciene and Technology (フォトポリマー学会) and

The Technical Association of Photopolymers, Japan （フォトポリマー懇話会)

Tuesday afternoon, June 24, 2025 at Medium Hall (693 seats) at Arcrea Himeji

TUTORIAL Session ORGANIZERS

SEIJI NAGAHARA (ASML), HARUYUKI OKAMURA (Osaka Metropolitan University)

Purpose of TUTORIAL

For the semiconductor industry’s scientists and engineers, this program provides an opportunity to learn the fundamentals of lithography materials science and technology.

半導体業界の人材育成の一環として、リソグラフィー材料に関する科学と技術の基礎を学ぶ機会を提供する

Target AUDIENCE of TUTORIAL

University students who are considering related company for a future job

Lithographers/process engineers /material engineers in semiconductor companies, materials/equipment suppliers

Scientists who work for the related science and technology

Resistration

The attendees of ICPST and members of TAPJ can join the sessioncan join this tutorial session with free of charge. Tutorial materials will be shared with the attendees from web site if speakers' permission is obtained. The detail will be annouced later.

LANGUAGE of the TUTORIAL SESSIOn

The tutorial will be given by English or Japanese. The language in the slides will be English.

TOPICS (TBD)

Lithography indutry general introduction

Lithography technology general introduction

i-line resist

KrF/ArF/ArFi/EUV/EB chemically amplified resist（PTD、NTD、developer）

Photo acid generators (PAG) and photo decomposable base (PDB)

Metal containing resists

Resist filtering technology

BARC, SOC, TC, MHM, rinse, shrink materials

Packaging materials

Special keynote talk: Device related tutorial and material application