ICPST and TAPJ are plannnig to provide opertunity to learn advanced materials processes for semiconductor manufacturing.
This tutorial session is a joint event of The Society of Photopolymer Sciene and Technology (フォトポリマー学会) and The Technical Association of Photopolymers, Japan (フォトポリマー懇話会)
Tuesday, June 24, 2025 at Medium Hall (693 seats) at Arcrea Himeji
TUTORIAL Session ORGANIZERS
SEIJI NAGAHARA (ASML Japan), HARUYUKI OKAMURA (Osaka Metropolitan University)
Purpose of TUTORIAL SESSION
For the semiconductor industry’s scientists and engineers, this program provides an opportunity to learn the fundamentals of lithography materials science and technology.
半導体業界の人材育成の一環として、リソグラフィー材料に関する科学と技術の基礎を学ぶ機会を提供する
Target AUDIENCE of TUTORIAL
University students who are
considering related company for a future job
Lithographers/process engineers
/material engineers in semiconductor companies, materials/equipment suppliers
Scientists who work for the related science and technology
Resistration
The attendees of ICPST and members of TAPJ can join this tutorial session with free of charge. Tutorial materials will be shared with the attendees from web site if speakers' permission is obtained.
LANGUAGE of the TUTORIAL SESSIOn
The tutorial will be given by English or Japanese. The language in the slides will be English.
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Tutorial special keynote speaker: Hayato Iwamoto (Sony Semiconductor Solutions Corporation)
Keynote speaker biography: Hayato Iwamoto received his BS and MS degrees in Meiji University, Japan, in 1990 and 1992, respectively. He joined Sony Corporation in 1992 and was engaged in the development of process and integration technologies for various semiconductor devices. Currently, he is a senior general manager of research division at Sony Semiconductor Solutions Corporation, where he supervises the device, process, material, integration and packaging technologies for advanced image sensors and displays with a wide range of expertise from research to mass production.
Presentation title: Process technology for evolving 3D stacked CMOS image sensors
Author(s) and affiliation(s): Hayato Iwamoto 1, 1 Sony Semiconductor Solutions Corporation
Abstract: スマートフォンなどに搭載されているイメージセンサは、スマートフォンをはじめとする多くの電子機器に搭載され、さまざまなアプリケーションで利用されている。 ソニーは2008年に世界初の裏面照射型CMOSイメージセンサの量産を開始し、その後、積層型およびCu-Cu接続型の3D積層技術を導入することで特性を向上させてきた。本講演ではこれらの技術進化と将来展開について講演する。